Subject: !!ELECTRO-MECHANICAL PACKAGING!
Organization: York University
This challenging position will appeal to Engineers with hands on design
and test experience gained in an electronic Space or Military product
environment. Use of MSC/Nastran, TMG and Pro/Engineer as design
optimization and automation tools would be a definite asset.
Experience (min 2 years) in utilizing Finite Element Techniques and Hand
Computational Analysis to design and verify PCB packaging concepts,
component/track placement and materials.
The position is in the greater Toronto area. Interested candidates should
contact Larry Panacci at
(905) 712-8666 or
or fax resume to
(905) 712-8667 and put to the attention of Larry.