Post by Larry Panac » Mon, 10 Jun 1996 04:00:00

Newsgroups: alt.engineering.electrical
Organization: York University

This challenging position will appeal to Engineers with hands on design
and test experience gained in an electronic Space or Military product
environment. Use of MSC/Nastran, TMG and Pro/Engineer as design
optimization and automation tools would be a definite asset.

Experience (min 2 years) in utilizing Finite Element Techniques and Hand
Computational Analysis to design and verify PCB packaging concepts,
component/track placement and materials.

The position is in the greater Toronto area. Interested candidates should
contact Larry Panacci at

(905) 712-8666 or
1(800) 850-1393

or fax resume to

(905) 712-8667 and put to the attention of Larry.


1. US-FL-Ft. Lauderdale-Mechanical Engineers for Electro-Mechanical Packaging at MOTOROLA

MOTOROLA Land Mobile Products Sector, Ft. Lauderdale, FL, has
opportunities available as MECHANICAL ENGINEER.  You will be responsible
for design, development and implementation of 2-way, hand-held personal
communication and related consumer products including CAD modeling,
electronic packaging and analysis.  You will work with injected molded
plastic parts, sheet metal, brackets, enclosures, etc.  You will use

Requirements:  Minimum BSME or equivalent experience in design and
development of similar products.  Should have demonstrated expertise in
Pro/ENGINEER or other similar CAD/CAE package.

MOTOROLA offers excellent salary, benefits, and relocation assistance.  
MOTOROLA encourages diversity in the workplace and is an Equal
Opportunity/Affirmative Action Employer, M/F/HDCP.

Please send  your resume to:  George Carlson, Motorola LMPS Staffing,
8000 West Sunrise Blvd., Ft. Lauderdale, FL, 33322.  FAX: (218)

format or word attachment please).  Submitting your resume in ascii via
email expedites your application

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